Technology Overview

         Hisense Photonics key innovative in-house technologies ensure our position as an optoelectronics industry leader. Our proven modular technology platforms, supported by a library of patents, ensure that each of our products have been designed to provide the most advanced and competitive optical solutions for today’s major mainstream applications. Our technical mandate is to simplify our customer’s increasingly complex optical communications challenges through functional and monolithic integration. This approach provides our customers with affordable solutions, unprecedented performance and lead-times that exceed increasingly more aggressive ‘time to market’ requirements.

        Hisense Photonics has a fully-integrated manufacturing model that enhances product reliability, manufacturability and performance. This philosophy spans chip fabrication (MOCVD wafer growth using Indium Phosphide and Planar Lightguide Circuit technologies), proprietary performance screening, highly automated packaging techniques and a robust final testing platform that guarantees our customer the highest quality product. We control all phases of the development and manufacturing process in-house. With multiple manufacturing locations, we provide our customers the safety of supply security and guard against unpredictable climatic events.